Polyimide film is synthesized by polymerizing PMDA and ODA in strong polar solvents through the process of forming film and imine treatment at high temperature, which possesses excellent physical, chemical, and electrical properties, atomic radiation resistant, solvent resistant, low and high temperature resistant. It performs successfully in the wide range of temperature as low as -269℃ and as high as 260℃.It is widely used for wrapping of magnet wire and cable, slot liner insulation, interlayer insulation in Motor, transformer and the substrates or overlay of flexible printed circuits board.

　　Thickness:0.0125, 0.025,0.05,0.075,0.10,0.125.
　　Width: 500,520,1000 (Customers special requirements on specifications could be negotiated case by case)　　

No.

Item

Unit

Value

1

Applicable Standards

—

IEC 60674-3-4 TO 6-1993

5

Tensile Strength
MD
TD

MPa

138
138

170
165

165
160

150
139

145
130

130
110

6

Elongation at rupture

%

35

50

60

60

60

60

7

Shrinkage

%

0.35

0.15

0.15

0.15

0.15

0.15

8

Breakdown strength 50Hz
Average
Individual

MV/m

120
110

180
140

160
130

145
120

120
100

115
90

9

Surface resistivity

Ω

1.0×10¹³

10

Volume resistivity

Ω.m

3.8×10¹⁰

11

Dielectric constant

—

3.5

12

Loss tangent

—

4×10^-3